Electronic Packaging

From medical to automotive to military applications, many microelectronic packages operate in extremely harsh environments that require extended service lives, presenting a significant challenge for the microelectronics community. Characterizing the failure mechanisms and predicting product life in such environments is critical to the long term reliability of these devices.

Southern Research provides electronic packaging reliability testing and failure analysis to help build robust microelectronic assemblies at low-cost. Using a Physics of Failure approach, both experimental testing and computational modeling techniques are used to ascertain environmental damage accumulation and characterize thermo-mechanical and hygro-mechanical failure behavior.

• Testing
  • Moisture Preconditioning
  • Temperature/Humidity Cycling
  • Vibration Testing
  • Cyclic Corrosion Testing
  • Radiographic Inspection
  • Mechanical and Thermal Property Testing
  • DSC, DMA, and TGA
• Failure Analysis
  • Hygro-Thermal Reliability Analysis
  • Material/Interfacial Adhesion Characterization
  • Product Life Expectancy Studies
  • BGA, CSP, and Underfill Evaluation
  • Scanning Electron Microscopy (SEM)
  • Surface Chemistry Composition Analysis
  • 3-D Laser Profilometry
  • Finite Element Analysis

Contact
Timothy P. Ferguson, Ph.D.
205-581-2893
ferguson@sri.org